Thin coating deposition by magnetron sputtering

Journal article

Authors / Editors

Oladijo, Philip

Research Areas

ENGINEERING AND TECHNOLOGY (Frascati classification)

Publication Details

Subtitle: Thin coating deposition by magnetron sputtering

Author list: Oladijo, Philip

Publisher: Elsevier

Publication year: 2018

Journal: Surface and Coatings Technology (0257-8972)

ISSN: 0257-8972

Languages: English-United States (EN-US)

Abstract

Advances in thin-film deposition expose new frontiers to structures and phases that are inaccessible by conventional chemical means and have led to innovative modification of existing materials' properties. Thin-film deposition by magnetron sputtering is highly dependent on ion bombardments; coupled with sublimation of solid target unto the substrate through momentum transfer. It is summarily base on phase change of target material under high-energy influence; corresponding controlled condensation of sputtered atoms on substrate material during which process parameters and growth conditions dictate the pace of the atomic scale processes for thin-film formation. Magnetron sputtering is a state-of-the-art thin film deposition technique versatile for several unique applications, especially in the semiconductor industry. Magnetron sputtering is very novel in its use to achieve low-pressure condition that maximizes and conserve stream of electrons for effective knocking of inert atoms into ions. This ensures the high-energy acquired is not dissipated in gas-phase collisions.

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